| Test/Inspection | Minimum Sample | Size | Level |
|---|---|---|---|
| Lot Size 200 or greaterDevices | Lot Size 1-199 Devices(See NOTE 1) | ||
| Minimum Required Tests | Level A | ||
| Documentation and Packaging | A1 | ||
| Documentation and Packaging Inspection (4.2.6.4.1) (non-destructive) | All devices | All devices | |
| External Visual Inspection | A2 | ||
| a. General (4.2.6.4.2.1) (non-destructive) | All devices | All devices | |
| a. General (4.2.6.4.2.1) (non-destructive) | All devices | 122 or all devices, whichever is less | |
| Remarking & Resurfacing (destructive) | See NOTE 2 | See NOTE 2 | A3 |
| Solvent Test for Remarking (4.2.6.4.3 A) (destructive) | 3 devices | 3 devices | |
| Solvent Test for Resurfacing (4.2.6.4.3 B) (destructive) | 3 devices | 3 devices | |
| Radiological (X-Ray) Inspection | A4 | ||
| X-Ray Inspection (4.2.6.4.4) (non-destructive) | 45 devices | 45 devices or all devices, whichever is less | |
| Lead Finish Evaluation (XRF or EDS/EDX) | See NOTE 3 | See NOTE 3 | A5 |
| XRF (non-destructive) or EDS/EDX (destructive) (4.2.6.4.5)(Appendix C.1) | 3 devices | 3 devices | |
| Delid/Decapsulation Internal Analysis (destructive) | See NOTE 4 | See NOTE 4 | A6 |
| Delid/Decapsulation (4.2.6.4.6) (destructive) | 3 devices | 3 devices | |
| Additional Tests (as agreed between Customer and Organization) | |||
| Remarking & Resurfacing (destructive) | See NOTE 2 | See NOTE 2 | A3 Option |
| Scanning Electron Microscope (4.2.6.4.3 C) (destructive) | 3 devices | 3 devices | |
| Quantitative Surface Analysis (4.2.6.4.3 D) (non-destructive) | 5 devices | 5 devices | |
| Thermal Testing | Level B | ||
| Thermal Cycling Test (Appendix C.2) | All devices | All devices | |
| Electrical Testing | Level C | ||
| Electrical Testing (Appendix C.3) | 116 devices | All devices | |
| Burn-In | Level D | ||
| Burn-In (Pre & Post) (Appendix C.4) | 45 devices | 45 devices or all devices, whichever is less | |
| Hermeticity Verification (Fine and Gross Leak) | Level E | ||
| Hermeticity Verification (Fine and Gross Leak) (Appendix C.5) | All devices | All devices | |
| Scanning Acoustic Microscopy (SAM) | Level F | ||
| Scanning Acoustic Microscopy (SAM) (Appendix C.6) | As specified | As specified | |
| Other | Level G | ||
| Other test/inspections | As specified | As specified | |
NOTES:
1. For very small lot sizes, less than ten (10) devices, this “destruct” test sample size may be reduced to one (1) device at the discretion of the Cognizant Engineer with Quality Assurance concurrence and Customer approval.
2. Devices for the Remarking & Resurfacing Inspection shall be selected from the Detailed External Visual Inspection lot.
3. Devices with possible lead finish anomalies shall be selected from the Detailed External Visual Inspection lot.
4. Devices for the Delid/Decapsulation Internal Analysis shall be selected from the Remarking & Resurfacing Inspection lot.
